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7. Dezember 2020

artimelt at the LabelExpo Americas

LabelExpo Americas is the largest event for the label and package printing industry in the Americas and will take place 8 - 10 JUNE 2021 in DONALD E. STEPHENS CONVENTION CENTER, CHICAGO. 

As a specialist and worldwide leader in linerless hot melt adhesive solutions, artimelt is taking the opportunity to be present with our experts at our booth no. 357.

As a modern company, we follow our innovative efforts by giving a live session presentation at our booth. Let our unique products inspire you. We will put special emphasis on our new bio-based products, which are unique and considered a premiere for the American market! 

Come and visit us at our booth. We look forward to meeting you.